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The Copper Cooler: Heat Sink for CPUs (PDF)

The University of Waterloo team investigated the redesign of a heat sink for cooling central processing units (CPUs). The new heat sink features an organic, branched fin design revolved around a circular base which is situated on top of the CPU. It will be part of an assembly with a fan mounted above the heat sink to facilitate forced convection, making it an active heat sink system.

2018 SkillsUSA Challenge Guide (PDF)

Additive manufacturing/3D-printing is changing the face of medicine as engineers and physicians are able to develop adaptive devices that are fully customized to the wearer. These devices often serve as assistive devices or tools for unique activities such as sports, hobbies or professions that the wearer is engaged in.